Application Challenges
In semiconductor packaging inspection, the primary tasks include identifying solder joint defects, wire-bonding anomalies, and interlayer misalignments. Given the intricate and delicate structure of advanced packaging, cameras must deliver high resolution and superior contrast imaging to clearly resolve fine details. At the same time, stringent production cycle requirements demand high-speed image acquisition and stable data throughput, ensuring the camera does not become a bottleneck in the inspection process.
Gemini 8KTDI
Deep Ultraviolet High-Speed TDI-sCMOS Camera
Gemini 8KTDI not only delivers a significant upgrade in sensitivity across its core application wavelengths, with quantum efficiencies of 63.9% at 266 nm and 58% at 355 nm in the UV range, and a peak of 93.4% at 420 nm in the visible range, but also pioneers the implementation of 100G CoF high-speed data interface technology. With an 8K line frequency up to 1 MHz, the overall throughput is doubled compared to the previous generation. Equipped with TUCsen’s stable and reliable cooling and noise reduction system, it effectively suppresses thermal noise during high-speed operation, minimizes data fluctuations, and improves measurement accuracy. This makes it particularly suitable for front-end semiconductor applications demanding both high precision and high throughput.
