Application Challenges
In wafer inspection, defects are often at the micrometer or even nanometer scale, directly impacting overall yield. Cameras must therefore provide ultra-high resolution and low-noise performance to capture subtle features such as particles, scratches, and pattern deviations. The high reflectivity of wafer surfaces and interference effects place additional demands on dynamic range, while global inspection of 12-inch and larger wafers requires a combination of large-format sensors and high-speed scanning capabilities to balance efficiency and accuracy.
Gemini 8KTDI
Deep Ultraviolet High-Speed TDI-sCMOS Camera
Gemini 8KTDI not only delivers a significant upgrade in sensitivity across its core application wavelengths, with quantum efficiencies of 63.9% at 266 nm and 58% at 355 nm in the UV range, and a peak of 93.4% at 420 nm in the visible range, but also pioneers the implementation of 100G CoF high-speed data interface technology. With an 8K line frequency up to 1 MHz, the overall throughput is doubled compared to the previous generation. Equipped with TUCsen’s stable and reliable cooling and noise reduction system, it effectively suppresses thermal noise during high-speed operation, minimizes data fluctuations, and improves measurement accuracy. This makes it particularly suitable for front-end semiconductor applications demanding both high precision and high throughput.
