TDI Camera for High Speed Imaging

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Overview

Dhyana 9KTDI Pro (shortened as D 9KTDI Pro) is a back-illuminated TDI camera based on advanced sCMOS back-illuminated thinning and TDI (Time Delay Integration) technology. It employs reliable and stable cooling packaging technology, covering a wide spectral range from 180nm ultraviolet to 1100nm near infrared. This effectively enhances the capabilities for ultraviolet TDI line scanning and low light scanning detection, aiming to provide more efficient and stable detection support for applications such as semiconductor wafer defect detection, semiconductor material defect detection, and gene sequencing.

82% High QE/Wide spectrum

The Dhyana 9KTDI Pro applies back-illuminated sCMOS technology, with a validated response wavelength range covering 180 nm to 1100 nm. The 256-level TDI (Time-Delayed Integration) technology significantly enhances the signal-to-noise ratio for weak light imaging in various spectra, including ultraviolet (193nm/266nm/355nm), visible light, and near-infrared. This improvement contributes to enhanced precision in device detection.
High Throughput up to 600 kHz @ 9K

The Dhyana 9KTDI Pro is equipped with CoaXPress-Over-Fiber 2 x QSFP+ high-speed interfaces, providing a transmission efficiency equivalent to 54 times that of back-illuminated CCD-TDI cameras, significantly improving equipment detection efficiency. The camera's line frequency can reach up to 9K @ 600 kHz, offering the fastest multi-stage TDI line scanning solution in the industrial inspection.
256 TDI Stage Provides High SNR

The Dhyana 9KTDI Pro is equipped with TDI imaging capability ranging from 16 to 256 levels, enabling enhanced signal integration within a given time frame. This feature enables capturing images with high signal-to-noise ratio, particularly in low light environments.

Specification >

Model: Dhyana 9KTDI Pro
Sensor Type: BSI sCMOS TDI
Sensor Model: Gpixel GLT5009BSI
QE: 82% @ 550 nm, 50% @ 350 nm, 38% @ 800 nm
Color / Mono: Mono
Array Diagonal: 45.4 mm
Effective Area: 45.36 mm x 1.28 mm
Resolution: 9072 ( H ) x 256 ( V )
Pixel Size: 5 µm x 5 µm
Operation Mode: TDI, Area
TDI Stage: 4, 8, 12, 32, 64, 96, 128, 160, 192, 224, 240, 248, 252, 256
Scan Direction: Forward, Reverse, Trigger Control
CTE: ≥ 0.99993
Data Bit Depth: 12 bit, 10 bit, 8 bit
Full-Well Capacity: Typ. : 14 ke- @ 10 bit, 15.5 ke- @ 12 bit
Dynamic Range: Typ. : 68.7 dB @ 12 bit, 63.6 dB @ 10 bit
Max. Line Rate: 300 kHZ @ 12 bit, 600 kHZ @ 10 bit, 600 kHZ @ 8 bit
Readout Noise: 7.2 e- @ 12 bit, 11.4 e- @ 10 bit
DSNU: Typ. : 1.5 e- @ 12 bit, 3.5 e- @ 10 bit
PRNU: Typ. : 0.30 %
Cooling Method: Air, Liquid, Cooling Speed 5 °C / min
Max. Cooling: 35 °C below ambient
Binning: 1 × 1, 2 x 1, 4 x 1, 8 x 1
ROI: Support
Trigger Mode: Trigger Input, Scan Direction Input
Output Trigger Signals: Strobe out
Trigger Interface: Hirose, HR10A-7R-4S
Timestamp Accuracy: 8 ns
Gain: Analog Gain: x2 ~ x8, Step 0.5, Digital Gain: x0.5 ~ x10, Step 1
Data Interface: CoaxPress-Over-Fiber 2 x QSFP+
Optical Interface: M72 / User Customization
Power Supply: 12 V / 8 A
Power Consumption: < 75 W
Dimensions: 100 mm x 100 mm x 145 mm
Weight: 1800 g
Software: Samplepro
SDK: C，C++，C#
Operating System: Windows, Linux
Operating Environment: Working: Temperature 0~40 °C, Humidity 0~85 %,
Storage: Temperature 0~60 °C, Humidity 0~90 %