Explore Next-Generation Imaging Solutions for Semiconductor Inspection at VISION 2026

time2026/09/18

Tucsen will exhibit at VISION 2026 in Stuttgart, Germany, from October 6–8, 2026, showcasing its latest imaging technologies for advanced semiconductor inspection. We will demonstrate how precision imaging improves inspection efficiency, accuracy, and system performance for applications such as wafer inspection, surface metrology, and substrate imaging !

VISION 2026 LinkedIn Invitation-0914 (1)

At the heart of our showcase is the Libra 27105, a high-throughput large-format CMOS camera built for next-generation inspection systems. Libra 27105 combines large-format imaging with high-speed data transmission through a 100G CoF interface, providing a powerful solution for applications requiring both high resolution and high throughput.

Libra 27105 (1)

Alongside Libra 27105, Tucsen will showcase a comprehensive imaging portfolio for semiconductor manufacturing, including:
● Large-format sCMOS camera solutions for applications requiring high resolution, high sensitivity, and large imaging areas.
High-speed TDI line scan camera solutions, available in both lightweight and high-performance configurations, supporting demanding inspection tasks with high throughput requirements.

TDI系列相机

● Single-photon-level sCMOS camera solutions, including the Aries 6504 series with multiple variants designed for ultra-sensitive imaging applications.

Our team will be available at Booth 8B25 to discuss how different imaging technologies can be matched to specific inspection challenges and application requirements.

 

Combining scientific imaging expertise with advanced semiconductor requirements, Tucsen develops high-performance cameras that deliver exceptional sensitivity, measurement accuracy, and reliable operation. Through close collaboration with leading sensor manufacturers and advanced FPGA and interface technologies, our solutions enable high-speed data processing for demanding inspection workflows.

Schedule a Meeting and Get Your Free Ticket

 

Ready to explore how advanced imaging technologies can enhance your semiconductor inspection systems? Visit Tucsen at Booth 8B25 to explore our latest camera solutions and discuss your imaging requirements with our technical team.

 

Event Details

● Date: October 6–8, 2026
● Location: Stuttgart Exhibition Center, Germany
● Tucsen Booth: 8B25

 

Contact our team to schedule your meeting. We will provide an exclusive voucher code for your complimentary VISION 2026 ticket.

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