Semiconductor inspection is a critical step in ensuring yield and reliability across the integrated circuit manufacturing process. As core detectors, scientific cameras play a decisive role—their resolution, sensitivity, speed, and reliability directly impact defect detection at the micro- and nanoscale, as well as the stability of inspection systems. To address diverse application needs, we offer a comprehensive camera portfolio, from large-format high-speed scanning to advanced TDI solutions, widely deployed in wafer defect inspection, photoluminescence testing, wafer metrology, and packaging quality control.
Spectral Range: 180–1100 nm
Typical QE: 63.9% @ 266 nm
Max. Line Rate: 1 MHz @ 8 / 10 bit
TDI Stage: 256
Data Interface: 100G / 40G CoF
Cooling Method: Air / Liquid
Spectral Range: 180–1100 nm
Typical QE: 50% @ 266 nm
Max. Line Rate: 600 kHz @ 8 / 10 bit
TDI Stage: 256
Data Interface: QSFP+
Cooling Method: Air / Liquid
Spectral Range: 180–1100 nm
Typical QE: 38% @ 266 nm
Max. Line Rate: 510 kHz @ 8 bit
TDI Stage: 256
Data Interface: CoaXPress 2.0
Cooling Method: Air / Liquid