2026/08/21The 14th Semiconductor Equipment, Materials and Core Components Expo (CSEAC 2026) is coming soon.
As semiconductor manufacturing continues to advance toward smaller features and more complex structures, inspection systems require faster and more precise imaging technologies to detect critical defects and maintain high production efficiency.
At CSEAC 2026, Tucsen will showcase our latest imaging technologies and camera solutions for semiconductor inspection, including high-speed TDI cameras and high-performance sCMOS cameras. These imaging technologies are designed to help inspection equipment manufacturers improve defect detection capability, increase throughput, and achieve more stable imaging performance across applications such as wafer inspection and advanced packaging.
We invite you to visit our booth and explore how Tucsen’s imaging technologies can support the next generation of semiconductor inspection systems.
Date: August 31 – September 2, 2026
Location: Taihu International Expo Center, Wuxi, China
Booth: C1-118
Discover Advanced Imaging Capabilities for Micron- to Nanometer-Scale Inspection
Our solutions are designed to support demanding inspection requirements such as:
Wafer Inspection
Supporting bright-field and dark-field imaging, high-speed scanning, nanoscale defect detection, and defect analysis.
Advanced Packaging Inspection
Enabling high-resolution imaging for RDL inspection, complex structures, and high-throughput inspection workflows.
High-Performance Imaging
Featuring large sensor formats, high sensitivity, and broad spectral response to address diverse inspection challenges.
Automated Optical Inspection (AOI)
Delivering fast, non-contact, and high-precision imaging performance for automated defect inspection systems.
These technologies help you improve defect detection capability, optimize inspection efficiency, and accelerate production deployment.
Connect with Tucsen at CSEAC 2026
Whether you are developing wafer inspection, mask inspection, advanced packaging, or AOI systems, our team looks forward to discussing how high-performance imaging can support your next-generation semiconductor inspection solutions.
Visit Tucsen Photonics at Booth C1-118 and discover the latest advancements in semiconductor imaging technology.
New products. New imaging capabilities. See you at CSEAC 2026！
