2026/09/30Tucsen will exhibit at SEDEX 2026 in Seoul from October 16–18, 2026, showcasing our latest imaging solutions for advanced semiconductor inspection and manufacturing.
Visit Booth C060 to explore how different camera technologies can support demanding inspection requirements, discuss your imaging needs and explore the right imaging solution with our engineers.
Explore Our Latest Semiconductor Imaging Solutions
At SEDEX 2026, We will showcase imaging solutions designed to address a wide range of semiconductor inspection and metrology requirements, from wafer, mask and display inspection to high-speed imaging and imaging in challenging EUV and SWIR environments.
Our solutions include:
● Tucsen Gemini TDI Platform, featuring up to 1 MHz line rates for fast, high precision inspection and continuous imaging.
● 100G high-throughput large-format cameras, including the new Libra 27105, for advanced semiconductor imaging and large volume data acquisition.
Explore our semiconductor imaging solutions to learn more about how Tucsen cameras address different inspection requirements.
Our TDI imaging technology and large-format camera solutions are designed to support high speed imaging and high throughtput image data processing for demanding inspection workflows.
Meet Tucsen at SEDEX 2026
Different semiconductor inspection tasks require different imaging approaches. Our technical team will be available at Booth C060 to discuss your application requirements and explore suitable imaging solutions for your inspection system.
Interested in learning more about Tucsen’s semiconductor inspection cameras and imaging solutions? Contact our engineering team to arrange a meeting.
We look forward to meeting you at SEDEX 2026 in Seoul!
Event Details
Date: October 16–18, 2026
Location: COEX Convention & Exhibition Center, Seoul, South Korea
Tucsen Booth: C060
Contact: support@tucsen.com
