2026/09/04Tucsen today announces the Libra 27105, a High Throughput camera and large format camera built for semiconductor inspection. With 100G CoF output and 105 MP resolution, Libra 27105 is positioned as a defect inspection camera and wafer inspection camera for advanced packaging, wafer inspection, defect inspection, and metrology inspection applications.
Built for High Speed Inspection Cameras in Advanced Packaging
Libra 27105 delivers a 39.7 mm diagonal field of view and 112 fps with 100G CoF, enabling high speed isnspection cameras performance across large panels and hybrid bonding wafers. The large sensor area reduces stitching, shortens takt time, and helps keep production lines moving in advanced packaging and semiconductor inspection systems.
105 MP Large Format Camera for Wafer and Defect Inspection
At 105 MP with 2.75 μm pixels, Libra 27105 captures fine RDL traces, TSV/TGV profiles, bump structures, and nanoscale anomalies. This makes it an effective wafer inspection camera and defect inspection camera for metrology inspection, supporting precise edge localization, dimensional analysis, and AI-based defect detection in advanced packaging lines.
High Image Uniformity for Stable Metrology Inspection
Pixel-level uniformity correction achieves PRNU as low as 0.30% and DSNU as low as 0.3 e⁻, providing stable data for WLI 3D reconstruction and metrology inspection. A compact thermal design reduces size, power, and system cost while maintaining the reliability required for high-volume semiconductor inspection equipment.
Libra 27105 targets key semiconductor inspection use cases, including:
● Panel-level packaging (PLP) inspection
● CoWoS inspection
● RDL fine-line inspection
● Hybrid bonding inspection
● TSV/TGV inspection
● Micro-bump inspection
As a large format camera and high throughput camera, Libra 27105 is engineered to serve as a core defect inspection camera and wafer inspection camera in advanced packaging, wafer inspection, and metrology inspection workflows.
About Tucsen and Libra 27105
With nearly 20 years of experience in scientific imaging and deep involvement in semiconductor volume production, Tucsen has built end-to-end capabilities spanning R&D, precision manufacturing, product delivery, and system integration. Cross-disciplinary teams cover optics, mechanics, electronics, algorithms, and software, working closely with customers to iterate quickly from solution validation to reliable production deployment.
Tucsen’s manufacturing infrastructure includes Class 100 and Class 1,000 cleanroom facilities with stringent contamination control, while standardized platforms and modular design support both volume production and small-batch customization. On the integration side, Tucsen provides FPGA, SDK, standard protocols, and customized development to ensure rapid system-level coordination in semiconductor inspection equipment.
Libra 27105 extends Tucsen’s portfolio of imaging solutions for advanced packaging, combining High Throughput camera performance, large format camera coverage, and 100G CoF bandwidth to meet the demands of High Speed Inspection Cameras in modern fabs and packaging lines.
Contact us to learn more about Libra 27105 and Tucsen’s semiconductor inspection imaging solutions.
