2026/08/25Semiconductor inspection requires imaging systems that can deliver higher speed, better sensitivity, and stable performance as defect sizes continue to decrease and inspection complexity increases. Applications such as wafer inspection, mask inspection, and advanced packaging inspection demand cameras with high-speed scanning, high signal-to-noise ratio, large-area imaging capability, and reliable operation.
However, conventional line scan cameras may face challenges at higher scanning speeds, where limited exposure time can reduce image quality and make low-contrast defects harder to detect.
Why TDI Technology for Semiconductor Inspection?
TDI technology provides an effective solution for high-speed inspection by accumulating signals across multiple sensor stages while synchronizing with object movement. Compared with conventional line scan cameras, TDI cameras collect more photons during scanning, improving signal-to-noise ratio and defect visibility without sacrificing throughput.
For semiconductor inspection, stable imaging performance also requires precise synchronization, thermal stability, and flexible system integration. These capabilities make TDI cameras well suited for demanding inspection environments.
Learn more about TDI technology: Why TDI Technology Is Gaining Ground
Gemini TDI Cameras: Designed for Semiconductor Inspection
Tucsen Gemini TDI camera series is designed to meet the demanding requirements of semiconductor inspection systems, combining high-speed imaging, high sensitivity, thermal stability, and flexible integration options.
High Sensitivity Across a Wide Spectral Range
Semiconductor inspection systems often operate under different illumination conditions. Gemini TDI cameras offer flexible sensor options covering a wide spectral range from 180 nm to 1100 nm.
The VIS version provides a typical QE of 94.2% at 460 nm, while the UV version achieves 65.8% QE at 266 nm, helping inspection systems capture more optical signals for challenging defect detection tasks.
High Image Uniformity and Thermal Stability
Consistent image quality is critical for high-precision inspection. Gemini TDI cameras provide pixel-level correction and advanced thermal control to maintain stable imaging performance during long-term operation.
With DSNU as low as 1.4 e⁻, PRNU from 0.018% to 0.05%, and temperature control accuracy of ±0.1°C, Gemini helps ensure reliable and repeatable inspection results.
Flexible Cooling Solutions for Different Equipment Requirements
Different inspection platforms have different requirements for thermal design, cleanliness, and system integration. Instead of a single cooling architecture, Gemini TDI cameras provide multiple thermal management options.
|
Product |
Cooling |
|
Gemini 8K TDI LT |
Fan cooling,Passive cooling |
|
Gemini 8K TDI |
Integrated air & water cooling,Air cooling |
|
Gemini 16K TDI |
TEC & Air cooling |
This flexibility allows system designers to select the appropriate balance between maximum performance, integration simplicity, and deployment efficiency.
Designed for Easier System Integration
High-performance imaging requires not only a capable sensor but also reliable data transmission and software support.
Gemini TDI cameras support high-speed interfaces including CXP for existing inspection system upgrades and CoF for high-bandwidth lossless data transmission.
Combined with a powerful SDK package, flexible parameter adjustment, multi-camera synchronization, development documentation, acquisition tools, and host software support, Gemini enables deeper system integration and customized inspection solutions.
For applications requiring optimized deployment and cost efficiency, Gemini also offers LT versions with a more compact design and simplified thermal architecture.
Gemini TDI Platforms for Different Semiconductor Applications
Different inspection applications require different balances between speed, resolution, and integration flexibility.
Gemini 8K TDI Platform – 1 MHz @ 8K, for front-end critical inspection
The Gemini 8K TDI series delivers up to 1 MHz line rates at 8K resolution with precision thermal management, enabling stable, high-SNR output under high-speed conditions to meet the extreme performance demands of front-end inspection.
Gemini 8K TDI LT Platform – 500 kHz @ 8K, compact and cost-optimized for back-end
The Gemini 8K TDI LT series replaces bulky water/air hybrid cooling with compact air-cooled or passive-cooling designs, reducing camera volume by 64%, weight by 75%, and power consumption by 50% for scalable back-end deployment.
Gemini 16K TDI Platform – 500 kHz @ 16K, for wide-field efficiency
With ultra-wide 16K line scan capability, the Gemini 16K TDI series reduces or eliminates multi-camera tiling, simplifying optical and mechanical design, lowering algorithmic complexity, and improving throughput, consistency, and system reliability for large-area inspection.
If you have specific requirements or need help selecting the right TDI camera for your system, feel free to contact our team for a consultation.
